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What is Chip Scale Packaging mean?
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
The concept was first proposed by Junichi Kasai of Fujitsu and Gen Murakami of Hitachi Cable in 1993. The first concept demonstration however came from Mitsubishi Electric.
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale package (WL-CSP). WL-CSP had been in development since 1990s, and several companies begun volume production in early 2000, such as Advanced Semiconductor Engineering (ASE).
referencePosted on 16 Dec 2024, this text provides information on Miscellaneous in Computer Hardware related to Computer Hardware. Please note that while accuracy is prioritized, the data presented might not be entirely correct or up-to-date. This information is offered for general knowledge and informational purposes only, and should not be considered as a substitute for professional advice.
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