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What is Organic Solderability Preservative mean?
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering.
The compounds typically used are from the azole family such as benzotriazoles, imidazoles, benzimidazoles. These adsorb on copper surfaces, by forming coordination bonds with copper atoms and form thicker filmsthrough formation of copper (I) – N–heterocycle complexes. The typical film thickness used is in the tens to hundreds of nanometers.
referencePosted on 14 Dec 2024, this text provides information on Miscellaneous in Electronics related to Electronics. Please note that while accuracy is prioritized, the data presented might not be entirely correct or up-to-date. This information is offered for general knowledge and informational purposes only, and should not be considered as a substitute for professional advice.
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