The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload.
Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating.
Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
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